1. In the power MOSFET the decreased
in the electron mobility with increasing temperature result in a rapid
increased in the on state resistance of the channel and hence the on state
drop.
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In IGBTs, this increase in voltage
drop is very small.
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2. The on stage voltage drop increases
by a factor of 3 between room temperature and 200 degree sallies.
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Here with the identical conditions,
the increment in the on state voltage drop is very small.
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3. All highest temperature, maximum
current rating goes down to 1/3 value.
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At high ambient temperature: IGBT is
extraordinary well suited.
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4. Current sharing in multiple
paralleled MOSFETs is comparatively poor than IGBTs.
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Current sharing in multiple parallel
IGBTs is far better than power MOSFET.
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5. The turn on transients is to
MOSFETs
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Turn on transients is identical
identical to IGBTs..
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6. Power MOSFET is suited for
applications that require low blocking voltages and high operating.
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IGBT is the preferred device for
applications that require high blocking voltages and lower operating
frequencies.
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7. it is less better in power handling
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It is better in power handling than
MOSFET.
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8. MOSFET have not PN junctions.
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IGBT have PN junction
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Labels: electronics